Thermal Analysis Engineer
Job Description
The primary responsibilities for this role will include, but are not limited to
- Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.
- Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.
- Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
- Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.
- Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.
- Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.
- Engage with external vendors and researchers to support collaborations and Intel's research pipeline.
Minimum Qualifications
: Minimum qualifications are required to be initially considered for this position.
- Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
- 6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.
- Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies.
- Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.
- Advanced experience in programming skills in Python or MATLAB for engineering applications.
- Hands-on experience with experimental setups and data analysis techniques for lab testing.
Minimum Qualifications
: Minimum qualifications are required to be initially considered for this position.
- Experience with advanced packaging technologies, including EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
- Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners.
- Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements.
- Strong analytical and problem-solving abilities to address unique engineering challenges effectively.
- Excellent organizational and communication skills, with experience presenting findings and mentoring team members.
Help us redefine the future of technology and innovation. Apply today to join a team that thrives on collaboration, expertise, and a shared passion for driving advancements in semiconductor research.
Job Type
Shift
Primary Location
Posting Statement
Benefits
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Not included in the source posting: about the role.
Skills
Who can apply
The employer didn't state any visa, work authorization, citizenship or clearance requirements in this posting. Confirm with the employer before applying.
Read automatically from the employer's posting text. Always confirm with the employer — requirements can change after a job is published.