Senior PDE Package Architect & Tech Lead (MTS)
Micron Technology, Inc.
SingaporePosted Discovered via the company's careers siteMatch locked
Full-time10+ years expEngineering Jobs
About the role
Micron Technology, Inc. in Singapore seeks a Principal Engineer / MTS, PDE Package Design to lead advanced package architecture from feasibility to production readiness. You will drive cross‑functional trade-offs across silicon, board, and assembly teams while mentoring engineers and advancing AI-enabled design workflows. The role requires a Master's degree and 10 years in package design, with Cad
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
Skills
artificial-intelligence
Who can apply
The employer didn't state any visa, work authorization, citizenship or clearance requirements in this posting. Confirm with the employer before applying.
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