Module Engineering - Day Shift 5 or 7

Day Shift Compressed Work Week (6:00 AM - 6:00 PM; Thursday-Saturday and alternating Wednesdays)

Key Responsibilities:

• Process & Equipment Development: Design and develop assembly processes and hardware configurations, using novel engineering concepts to advance Intel's foundry packaging roadmap.
• Reliability & Stress Evaluation: Develop, calibrate, and maintain equipment used to evaluate silicon and packaging technologies under simulated field conditions (including thermal cycling, heat, humidity, and mechanical stress).
• Vendor & Material Qualification: Establish raw material specifications for contract assemblers and material vendors, partnering with supplier quality and procurement to enforce process compliance.
• Early Failure Detection: Create and implement new reliability screening techniques, acceleration methods, and quality screens to enable early detection of potential packaging defects.
• Process Control & Characterization: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to define equipment specifications, optimize yields, and document results in technical white papers.
• Design-for-Manufacturability (DFM): Ensure physical layout designs are manufacturable within foundry process flows, overseeing the full cycle of package manufacturing procedures.
• Technical Consultation: Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing guidance on process improvements.
• Technology Standardization: Drive standardization across product qualification frameworks and manufacturing quality systems, engaging with technology development teams to mitigate product milestone risks.

As a Successful Candidate, You Will Bring:

• Customer-Centric Mindset: Passion for understanding, consulting, and delivering highly specialized technical solutions to external foundry customers.
• Analytical Problem Solving: Analytical thinker focused on diagnosing complex mechanical, thermal, and materials-related packaging defects.
• Strong Strategic Collaboration: Highly effective at partnering across diverse matrixed teams, global engineering groups, and external supplier networks.
• Adaptability & Drive: High level of personal initiative to lead continuous improvement projects and adjust to changing product priorities.

Apply today to join Intel Arizona's Foundry Technology Manufacturing team. Collaborate with global pioneers, lead advanced reliability initiatives, and build a rewarding engineering career.

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Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 1+ year of relevant experience.

Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.

• 6+ months of experience with Statistical Process Control (SPC)and/or Design of Experiments (DOE)principles.

Preferred Qualifications:

• 1+ years of experience: • Working inside a technology development or semiconductor manufacturing environment.
• Semiconductor packaging processes, including assembly, material selection, or reliability engineering within a foundry context.

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.