Module Development Defect Metrology Engineer
Job Description
Business group
Key Responsibilities
- Lead the development of advanced manufacturing metrology defect inspection tool development, including new tool selection, automation optimization, equipment metrology development, and system integration.
- Drive process and hardware development of defect inspection tool to enable high-volume manufacturing and future technology innovations.
- Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
- Partner with equipment and material suppliers to implement enabling process technologies and drive advancements.
- Optimize production efficiency, manufacturing techniques, and output for both new and existing tools.
- Leverage statistical process control and data analytics to enhance process stability and drive continuous improvement.
- Recommend and implement modifications to operational equipment to improve efficiency and scalability.
- Collaborate with cross-functional teams to ensure seamless process integration and alignment with project deliverables.
Behavioral traits
- Demonstrated success in leading programs from strategy formation through high-volume production and continuous improvement initiatives.
- Recognized technical leadership with a proven ability to solve complex engineering challenges and drive innovative solutions.
- Strong collaboration skills across functional areas like yield, operations, and supplier management.
Qualifications
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM field with 6+ years of semiconductor experience
OR
OR
PhD in the same fields with 2+ years of semiconductor experience.
- +2 years of experience in: • Manufacturing process development, statistical process control, and process improvement methodologies.
- Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology in developing defect inspection method.
Preferred Qualifications
- Experience in metrology for advanced packaging technologies, such as hybrid bonded interconnects, ultra-fine pitch solder connections, or RDL-based packaging.
Intel is searching for innovative engineers who are passionate about shaping the future of semiconductor technology. Bring your expertise, creativity, and dedication to our team and contribute to groundbreaking advancements in the industry. Apply today and become a pivotal part of Intel's mission to deliver world-changing technologies.
Job Type
Shift
Primary Location
Posting Statement
Benefits
Work Model for this Role
This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Not included in the source posting: about the role.
Who can apply
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