Group Leader – Die Attach & Underfill
3D Glass Solutions
IndiaPosted Discovered via the company's careers siteMatch locked
Full TimeEngineering Jobs
About the role
Job/Position Summary The Group Leader - Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect a
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
Who can apply
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