Dry Etch - DMTS, PD, Advance NAND

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a DMTS (Distinguished Member of Technical Staff), you will participate in a groundbreaking Next Generation NAND research and development Dry Etch team moving Advanced NAND and dry etch technology forward. The position provides ample chances for innovation, cooperation, and exploring new scaling methods with Next Generation NAND. A DMTS Dry Etch Engineer is a senior individual contributor and top industry expert who defines, develops, and transfers advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other areas including Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will operate innovative dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to:

Leading advancements in Dry Etch technology and essential module development

• Act as a technical expert for dry etch process, hardware and applications in NAND technology development at F10, Singapore.
• Your position encourages delivering broad technical vision, deep domain expertise, and perspective advised by extensive knowledge of dry etch physics/chemistry.
• Define the equipment roadmap. Work together with suppliers and develop a mechanism-focused logical hardware roadmap essential for the upcoming generation NAND dry etch.
• Able to benchmark Micron NAND dry etch capability against outstanding industry standards and translate external findings into internal advantage.
• Provides forward-looking technical insight on dry etch trends, tool capabilities, and integration risks.
• In addition to Micron-specific responsibilities, the individual is encouraged to bring broad perspective and external insight from prior experience across highly reputed semiconductor companies.
• Provide technical mentorship and direction to SMTS/STS engineers; raise overall dry etch technical capability within the Singapore NAND organization.
• Resolve the most complex NAND yield, defectivity, and integration challenges through deep expertise in plasma physics, surface interactions, and materials.
• Represent Micron Singapore NAND dry etch interests at international conferences, cross-site and cross-company technical forums.
• Contribute towards Technical Leadership Program.
• Mentor less experienced engineers and encourage skills within the team.

• Collaborate and lead multi-functional teams to solve sophisticated structural problems.
• Simplify problems through model-based problem solving.
• Champion AI based solutions through the TD ecosystem.
• Lead collaborative efforts across Technology Development, Process Integration, and Manufacturing.
• Develop and innovate dry etch methods to satisfy structural and electrical requirements.
• Lead innovative (FOAK) dry etch process development, including recipe architecture, EPD strategy, control plans, and integration alignment.
• Solid presentation skills in executive meetings. Present process and technology roadmaps for current and future technology nodes.
• Demonstrate predictive capability of a future issue and proactively build mitigation plan.
• Comfortable influencing technology roadmaps in other process areas.

• Serve as a resource and guide for colleagues in dry etch technology and/or project management.
• Provide critical updates to upper management on project status and impacts.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

• Demonstrated interest in research and development environment.
• 15-20 years' experience in dry etch process development within R&D (NAND, DRAM or Logic) moving into manufacturing roles, with 10-15 years specifically in memory products such as NAND and DRAM.
• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
• Demonstrated leadership in problem solving. Experience in managing technical projects.
• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).
• Expertise in statistical process control and analysis.
• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
• Lead supplier head to heads.
• Strong computer skills, including MS Office, and SAS software like JmP and similar.
• Data science basics / Python coding / AI coders could be preferred over candidates without this experience.

• PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with 15-20 years of applicable dry etch process development background
• BS/MS (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with over 18 years of pertinent experience