Sr. Packaging Engineer (Semiconductor)
Semtech
IndiaPosted 17 days agoDiscoveredMatch locked
Full TimeEngineering Jobs
About the role
Responsibilities: · Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio. (25%) · OSAT Partner Management: Serve as a technical interface with external asse
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
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