Senior RF Packaging Tech Lead — Wafer-to-Package Integration
QUALCOMM, Inc.
SingaporePosted 15 days agoDiscoveredMatch locked
Full-time10+ years expManufacturing Jobs
About the role
Qualcomm RF360 Singapore is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre-assembly, Cu pillar bumping, and die sort. You will drive development and integration of RF SiP packaging processes and lead technology transfer from development to high-volume manufacturing with global partners. The role requires 10 years in semicon
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
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