Senior Process Engineer: Ultra-Thin Die Packaging & Scale-Up
STATS ChipPAC
SingaporePosted about 1 month agoDiscoveredMatch locked
Full-timeManufacturing Jobs
About the role
STATS ChipPAC is seeking an experienced Senior Process Engineer to drive process development and scale-up for wafer assembly steps such as back grinding, dicing, laser groove, edge trimming, and lamination in our 2.5D/3D packaging lab. The role focuses on delivering ultra-thin, high-yield, strong diced dies for advanced packaging, with responsibilities spanning process optimization, characterizati
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
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