Senior HBM Packaging Engineer — Yield & AI (Singapore)
Micron Memory Malaysia Sdn Bhd
SingaporePosted 11 days agoDiscoveredMatch locked
Full-timeEngineering Jobs
About the role
Micron Technology, Inc. in Singapore seeks a Senior Product Engineer (Pkg PE MFG) to drive package and HBM product engineering within the HBM Systems team. You will lead cross-functional efforts to improve yield, reduce defects, and optimize test coverage while collaborating with Fab, TD, and QA to ship high‑quality end products. The role emphasizes data-driven problem solving, statistical analysi
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
Skills
artificial-intelligencemachine-learningqa
Who can apply
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