Packaging Module Development Engineer

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• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.

• The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.

• The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.

• The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.

• The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

• Demonstrated ability to work seamlessly between experiments and simulations.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.

• 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability

• 3+ years of experience with Finite Element Analysis tools

• 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.

• Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.

• Experience with designing, planning and executing experiments, along with interpretation of results.

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

• Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.

• Programming/script development with artificial intelligence and machine learning concepts.

• Previous related work experience in a semiconductor foundry preferred.

Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us!

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.