Packaging Module Development Engineer

• Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

• Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

• Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.

• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.

• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

• Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.

• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.

• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.

• Bachelor's degree with 4+ years of experience or  Master's degree with 3+ years of experience  or Ph.D   in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.

• 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.

• Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.

• Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.

• Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.

• Knowledge of reliability and quality requirements for semiconductor packaging.

• Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.

We are excited to welcome passionate engineers who thrive on innovation, collaboration, and driving advancements in technology. If you are ready to make an impact and help shape the future of semiconductor packaging, we invite you to apply today.

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.