CPU Floorplan Lead
Intel
Bangalore, KarnatakaPosted 14 days agoDiscoveredMatch locked
Full TimeEngineering Jobs
About the role
Job Details Job Description: Defines the physical dimensions of the CPU IP with consideration for overall product costs such as die size optimization, die per reticle/good die per wafer maximization, and right technology selection as it pertains to metal layers and reuse strategy across different SKUs in a product family. Performs integration of all dies in a package and completes the relevant che
Not included in the source posting: about the role, what you'll do, qualifications, benefits.
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