Packaging Module Development Engineer

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements. Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment.

Other Job scope:

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window and understand process / equipment / materials / chemistry interaction.
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.
• Strong analytical and problem-solving skills.
• Work with ambiguity in a fast paced, constantly changing product roadmap environment
• Self-initiative, action-oriented by influencing, written and verbal communication skills with the ability to work independently.
• Flexibility in changing priorities and responsibilities to support business needs.

• The candidate must have a Bachelor’s degree in Biomedical Engineering Materials Science and Engineering, Chemical Engineering, , Mechanical Engineering, or related engineering degree or any related STEM degree.

OR Master’s degree in the same fields.

Minimum 3+ months of experience as a combination of the following:

• Circuit assembly, embedded programming.
• Engineering programming skills in tools like Matlab, Python and CAD Modeling.

• Experience with commercial Mechanical and/or CFD modeling tools like Comsol, Fluent, Ansys, or similar.
• Semiconductor and/or packaging processing.
• Programming/script development with artificial intelligence and machine learning concepts.
• Demonstrated ability to work seamlessly between experiments and simulations.
• Plating chemistry and Electrochemistry fundamental knowledge are a plus

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.