Advanced Packaging Module Development Engineer

• Technology Development & Enablement: Drive technology development for high-volume manufacturing and future technology nodes, providing process integration and equipment solutions to meet desired device specifications.
• Process Design & Development: Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Pathfinding & Roadmap Development: Perform pathfinding activities in support of process and hardware development, enabling the manufacturing of innovative device architectures, and develop technology roadmaps for future product generations.
• Manufacturing Optimization: Recommend and implement modifications to operating equipment to improve production efficiency, refine manufacturing techniques, and optimize production output for existing products.
• Supplier Collaboration: Partner with key equipment and materials suppliers to develop and implement enabling elements of technology, building cost-sensitive roadmaps in collaboration with the vendor ecosystem.
• Feasibility Studies: Perform process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies.
• Industry Awareness: Remain current on relevant industrial process and material manufacturing technical trends, developing a forward-looking view of Intel's future process technology needs to push the industry forward.
• Statistical Analysis & Experimentation: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions and process improvements.
• Automation & Systems Development: Leverage hands-on experience with robotics, automation systems, vision systems, and image processing to advance manufacturing capabilities.

• A Natural Problem-Solver: You thrive when faced with complex challenges and approach them with creativity, curiosity, and a structured mindset.
• Adaptable & Resilient: You embrace change and ambiguity, pivoting quickly when priorities shift without losing momentum or focus.
• A Collaborative Team Player: You build strong relationships across teams, functions, and supplier ecosystems, knowing that the best outcomes come from working together.
• An Effective Communicator: You can translate complex technical concepts into clear, actionable insights for diverse audiences, from engineers to leadership.
• Self-Motivated & Driven: You take ownership of your work, proactively seek out opportunities to improve processes, and are passionate about making a meaningful impact.
• Detail-Oriented: You bring precision and rigor to everything you do, understanding that in semiconductor manufacturing, the smallest details can make the biggest difference.
• Innovative & Forward-Thinking: You are passionate about staying ahead of industry trends and are energized by the opportunity to shape the future of semiconductor technology.

Are you ready to be part of a team that is literally building the future? At Intel's Hillsboro, Oregon campus, you'll have the resources, the talent, and the mission to do work that truly matters - not just for Intel, but for the world.

• Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4+ years of relevant industry experience; or a PhD degree in the same fields with 3+ years of relevant experience.
• Relevant experience will be any of the following: • Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Hands-on experience with robotics, automation systems, vision systems, or image processing.

• 4+ years of experience in: • Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Programming experience in Python or MATLAB.
• Troubleshoot complex manufacturing processes and equipment.
• Packaging processes, equipment automation development, or project management.
• Semiconductor device physics and advanced packaging technologies.

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.