Design Lead
HCLTech
Bangalore, Tamil Nadu, IndiaPosted 24 days agoDiscoveredMatch locked
Job Summary
Experience with Cadence APD IC Package/substrate Design experienceGood experience with Flip Chip and Wire Bond designsWorked from Die pin list to Tape outGood understanding of package fabrication and assembly rules related to flip chip designs.Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantageShould have experience in working with High-speed interfaces such as PCIe, LPDDRx, GDDR, XGMII, etc.,Good knowledge and understanding in Signal Integrity and Power Integrity requirementsShould be able to work with customer SPOC independently.Good Exposure to Stackup design, DFM, DFA rules and adherence.Experience with Cadence APD IC Package/substrate Design experience
Key Responsibilities
Signal Integrity toolExpertSpecifically, in Cadence Sigrity 2.5D and 3D-EM and Agilent ADS.Power Integrity toolExpertSpecifically, in Cadence Sigrity 2.5D and 3D-EM and Hspice.Allegro toolKnowledgeBasic knowledge in Viewing/Understanding the routing details and extracting quick reports.Lab measurement equipmentGoodFamiliarity with Vector Network Analyzer (VNA) and Oscilloscopes.
Skill Requirements
null
Other Requirements
null
Not included in the source posting: about the role, benefits.
Who can apply
The employer didn't state any visa, work authorization, citizenship or clearance requirements in this posting. Confirm with the employer before applying.
Read automatically from the employer's posting text. Always confirm with the employer — requirements can change after a job is published.