Thin Films Module Development Engineer

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Core Responsibilities:

• Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
• Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
• Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
• Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles
• Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability
• Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers
• Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

With at least 1+ years of experience in:

• Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
• Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design

Preferred Qualifications:

• Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
• Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
• Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
• Proficient with data analysis software including JMP, Excel, Python, R, SQL
• Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
• Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
• Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
• Availability to work on site and support 24/7 manufacturing operations with on-call rotation

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.