Design Lead

3-6 Years industry experience with  Mentor Expedition tools from setting up layout constraints, placement, routing and releasing to fab.Project requirements understanding, involve in High speed and High layer count PCB Design for complex circuit architectures / designs, Microstrip and stripline designs, stack-up designs.Experience with Type3 & Type4 PCB designs.Able to create symbol and footprint. Good experience with IPC Standards.Experience in HDI (Blind/Buried), stacked, staggered, back drilling, Flex design, Rigid Flex, RF circuit boards, micro-via technology is a must.Should have knowledge of IPC standards for PCB manufacturing activities, PCB assembly and Rigid PCB assembly.Experience with DDR3, SGMII, USB, SATA, PCIe, high speed, analog, RF, controlled impedance routing and High-Power boards.Should have thorough understanding of Signal Integrity aspects of PCB routing.   Good experience with CAM350/Valor (Gerber verification).Ability to read and understand electronic schematics.