APTD SWA Module Engineer On-Shift (Day shift)

Responsibilities include, but are not limited to:

• Receive written and verbal shift pass-downs from the outgoing shift and align priorities with management.
• Spend the majority of the shift on the factory floor supporting equipment and process-related issues while creating and updating specifications and Requests for Change (RFCs) as needed.
• Execute non-standard procedures and perform panel inspections and imaging activities to collect development data.
• Communicate critical issues and updates to tool owners, lot owners, and other stakeholders.
• Provide thorough written and verbal shift pass-downs to incoming shift personnel to ensure seamless operational continuity.
• Support new tool qualification and enablement activities.
• Assist with lot disposition decisions and process recovery actions to maintain production flow.

The ideal candidate will demonstrate:

• Strong problem-solving, analytical, and troubleshooting skills.
• Effective verbal and written communication skills, with the ability to collaborate across engineering teams, factory personnel, and customers.
• Flexibility and adaptability in a fast-paced manufacturing environment.
• Ability to work independently with minimal supervision while managing changing priorities.
• Strong organizational skills and a proactive, self-motivated approach.
• Commitment to achieving both individual and team objectives.

Minimum Qualifications:

• Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related technical discipline, along with 2+ years of experience in a combination of lithography, exposure mask processes, wet etch processes, and dry etch processes.

• Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related technical discipline, along with 1+ year of experience in a combination of lithography, exposure mask processes, wet etch processes, and dry etch processes.

Preferred Qualifications:

• Experience with statistical data analysis, process characterization, and manufacturing quality systems.
• Experience applying Design of Experiments (DOE) methodologies and Statistical Process Control (SPC).
• Knowledge of manufacturing process control and reliability testing.
• Experience in semiconductor manufacturing, advanced packaging, or packaging substrate development.
• Familiarity with metrology tool recipe development, optimization, and troubleshooting.
• Demonstrated ability to solve complex technical problems and collaborate effectively across cross-functional teams.
• Knowledge of factory operations and continuous process improvement methodologies.

Join a team where innovation meets impact. Be part of Intel's journey to shape the future of technology, apply today.

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.