EMIB-T Substrate Yield Lead

• Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness.

• Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification through execution.

• Lead daily yield huddles and cross-functional reviews to ensure program execution remains on track and yield risks are identified and addressed with urgency.

• Proactively identify, prioritize, and drive closure of critical yield, reliability, process, and supplier-related issues with minimal management oversight.

• Partner closely with substrate suppliers, substrate module engineers, substrate integration, manufacturing teams, design teams, Q&R organizations, and platform integration to achieve technology and business milestones.

• Establish clear accountability, track actions, challenge roadblocks, and ensure commitments are delivered on schedule.

• Drive yield readiness assessments, risk mitigation plans, and executive communications for program reviews.

• Define and scale the yield intelligence infrastructure needed for EMIB-T, including dashboards, automated analytics, computer vision, AI/ML defect detection, and automated defect classification.

• Enable successful EMIB-T deployment and scaling across multiple products and business groups, supporting both IFS and IPG programs.

• Masters degree with 6+years or PhD with 4+years in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline.

• 5+ years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.

• Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.

• Strong analytical and problem-solving skills with the ability to make data-driven decisions in complex environments.

• Experience working across multiple organizations and influencing stakeholders to achieve results.

• Demonstrated ability to independently manage complex technical issues, execute with urgency, and drive actions to closure.

• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.

• Experience working directly with substrate suppliers and external manufacturing partners.

• Demonstrated program leadership experience, including coordinating cross-functional technical teams and driving execution in high-visibility, high-impact environments.

• Experience with advanced packaging technologies, including EMIB, EMIB-T, TSV, 2.5D/3D integration, substrates, or heterogeneous integration.

• Prior experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.

Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

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