: Program Manager - Advanced Packaging (E4)

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Applied Materials

Santa Clara, CAexternalUnknownPosted 14 days ago (Jul 29, 2026)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. @@HD@@ What We Offer@@/HD@@ Salary: $133,500.00 - $183,500.00 Location: Santa Clara,CA You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. @@HD@@ Key Responsibilities@@/HD@@ @@HD@@ • Lead the development and execution of advanced packaging and heterogeneous integration@@/HD@@ programs, including

EMIB, CoWoS, multi-wafer stacking, TSV, micro-bump interconnects, and 2.5D/3D packaging technologies

. • Drive cross-functional collaboration across R&D, process integration, design, manufacturing, and supplier teams to deliver solutions involving

W2W/D2W bonding, chip-package optics (CPO), and next-generation semiconductor packaging architectures

. • Manage program schedules, technical risks, and product commercialization activities while optimizing

thermal management, packaging reliability, yield, and manufacturing readiness

from technology development through high-volume production. @@HD@@ • Customer Engagement Leadership@@/HD@@ • Lead end-to-end customer programs, including

technical alignment, schedule execution, and resource coordination

• Serve as the primary interface between IMS, internal business units, and external customers • Drive proactive communication and issue resolution to ensure program success •

Program Execution & Delivery

• Manage complex, multi-disciplinary programs across global teams • Own

program timelines, milestones, risk management, and deliverables

• Ensure alignment across IMS, business units, BD and customer accounts teams •

Technical Strategy & Expertise

• Apply in-depth knowledge of

advanced packaging inflections

including: • Logic (2.5D/3D integration, chiplets, hybrid bonding) • DRAM (HBM, TSV-based integration) • NAND (3D NAND scaling and packaging trends) • Translate customer needs into

IMS solution strategies

•

Value Articulation

• Clearly communicate and position

IMS value propositions

to: • Internal Applied Materials business units • External customers and partners • Support business growth through

technical storytelling and solution alignment

•

Cross-Functional Collaboration

• Work seamlessly with

globally distributed teams

across engineering, sales, and operations • Foster a collaborative, high-performance team environment

Qualifications

@@HD@@ Required • Education:@@/HD@@ • Bachelor's or Master's degree in

Electrical Engineering, Mechanical Engineering, Materials Science

, or equivalent •

Experience

• Minimum

5 years of program management experience

in a

customer-facing role

• Proven track record of successfully driving

technical programs with external customers

•

Technical Expertise

• Strong understanding of

advanced semiconductor packaging technologies

across logic, DRAM, and NAND •

Skills & Competencies

• Excellent

communication and presentation skills

• Ability to clearly articulate complex technical concepts and value propositions • Strong

organizational and project management skills

• Demonstrated ability to manage

multiple priorities in a dynamic environment

•

Work Style

• Self-starter with the ability to work

independently with minimal supervision

• Collaborative team player with strong

Additional Information

@@HD@@ Time Type:@@/HD@@ @@HD@@Full time Employee Type:@@/HD@@ @@HD@@Assignee / Regular Travel:@@/HD@@ @@HD@@Yes, 20% of the Time Relocation Eligible:@@/HD@@ Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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